Books in category Technology & Engineering – Material Science

  • Ground Improvement and Geosynthetics

    Ground Improvement and Geosynthetics
    Anand J. Puppala, Jie Huang, Jie Han, Laureano R. Hoyos

    Ground Improvement and Geosynthetics presents the most current research on ground improvement and geosynthetics.

  • Second Generation HTS Conductors

    Second-Generation HTS Conductors
    Amit Goyal

    The second method developed was the Inclined-Substrate-Deposition (ISD). The third method invented is called the Rolling-assisted-biaxially-textured-substrates (RABiTS).The book is divided into four sections.

  • Advances in Solid State Physics 46

    Advances in Solid State Physics 46
    Rolf Haug

    The present volume 46 of Advances in Solid-State Physics contains the written versions of selected invited lectures from the spring meeting of the Arbeitskreis Festk√ɬ∂rperphysik of the Deutsche Physikalische Gesellschaft which was held …

  • Properties of Fresh Concrete

    Properties of Fresh Concrete
    H.J. Wierig

    This book presents new information on concrete properties and production in the light of the widespread use of ready mixed concrete and new concreting materials.

  • Globalization of Materials R D

    Globalization of Materials R&D
    National Research Council, Division on Engineering and Physical Sciences, National Materials Advisory Board, Committee on Globalization of Materials Research and Development

    To better understand this trend and its implications for the U.S. economy and national security, the Department of Defense asked the National Research Council to assess the status and impacts of the global spread of MSE R&D. This book …

  • Effects of adhesive formulation and age on strength of bonded butt joints

    Effects of adhesive formulation and age on strength of bonded butt joints
    John Thomas Quirk, Theodore Thomas Kozlowski, Richard Frederick Blomquist

    Effects of formulation and age of adhesive on joint strength were studied on butt joints of slash pine bonded with an epoxy-resin adhesive.

  • Characterization of High Tc Materials and Devices by Electron Microscopy

    Characterization of High Tc Materials and Devices by Electron Microscopy
    Nigel D. Browning, Stephen J. Pennycook

    This is a clear and up-to-date account of the application of electron-based microscopies to the study of high-Tc superconductors.

  • Materials Science and Engineering for the 1990s

    Materials Science and Engineering for the 1990s:
    Commission on Physical Sciences, Mathematics, and Resources, Solid State Sciences Committee, Committee on Materials Science and Engineering, Division on Engineering and Physical Sciences, National Materials Advisory Board, Board on Physics and Astronomy, Commission on Engineering and Technical Systems, National Research Council

  • Stress strain behavior of films of four adhesives used with wood

    Stress-strain behavior of films of four adhesives used with wood
    William Turner Simpson, Vernon R. Soper

    Mechanical properties of thermosetting and thermoplastic polyvinyl-acetate adhesives and a resorcinol resin adhesive are evaluated and compared for use in designing adhesive joints for wood. (Author).

  • Patterns Defects and Microstructures in Nonequilibrium Systems

    Patterns, Defects and Microstructures in Nonequilibrium Systems
    D. Walgraef

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